Graphene superlattices show gate-controlled spin switching in latest Nature Communications study
A new study in Nature Communications reports gate-controlled inversion of spin signals in graphene superlattices, a result that adds a practical control knob to graphene spintronics research and could inform future low-power device designs.
Graphene sensor prototype powers temperature readings without a battery in Arkansas-Michigan test
Researchers at the University of Arkansas and the University of Michigan say they have demonstrated the first ultra-low-power temperature sensor powered by graphene-based solar cells, a battery-free design that could reduce maintenance in remote monitoring and wearable devices.
Premier Graphene lands first Mexico defense contract as graphene materials move into production testing
Premier Graphene said on April 23, 2026 that it secured its first contract with Mexico’s defense sector, a move that turns its graphene-based protective-wear materials into an initial production run for qualification testing.
Black Swan Graphene lifts UK production capacity past 140 tonnes as graphene manufacturing scales up
Black Swan Graphene says its expanded Consett, United Kingdom facility is now operating at industrial scale, with annual output capacity lifted to more than 140 tonnes. The company’s latest commissioning step marks a concrete shift from pilot production toward repeatable manufacturing for commercial graphene products.
GMG approves final AU$1.4 million to complete 10-ton graphene plant in Brisbane
Graphene Manufacturing Group has approved the final AU$1.4 million needed to complete its Gen 2.0 graphene plant in Brisbane, a move that keeps the 10-ton-per-year facility on track for mid-2026 commissioning.
Adisyn Says Low-Temperature Graphene Film Could Open a Semiconductor Path Beyond Copper Interconnects
Adisyn said on April 20, 2026, that it had demonstrated continuous graphene formation on a 1-centimeter coupon using an industrial atomic layer deposition system at temperatures below 450C, a milestone it says could help address copper interconnect limits in advanced chips.