UC Santa Barbara researchers say they have identified the quantum mechanism behind hot-carrier degradation in silicon chips, showing that a single energetic electron can trigger bond breaking at the silicon-oxide interface.
Adisyn said on April 20, 2026, that it had demonstrated a continuous graphene layer on a 1-centimeter coupon using industrial atomic layer deposition equipment, a result the company says is designed to fit semiconductor manufacturing limits rather than force a new process flow.
Adisyn said on April 20, 2026, that it had demonstrated graphene formed at low temperature for semiconductor use, a process milestone aimed at easing integration into chip manufacturing lines where heat limits are strict.
Covalent on April 23 launched Covalent Connect, a platform designed to consolidate advanced materials characterization into one workflow as companies face more complex analysis needs across semiconductors, energy storage and biotech.
Adisyn said on April 20, 2026, that it had demonstrated continuous graphene formation on a 1-centimeter coupon using an industrial atomic layer deposition system at temperatures below 450C, a milestone it says could help address copper interconnect limits in advanced chips.
Black Semiconductor has secured €211 million in support for its Aachen graphene photonics project, a financing package aimed at building a 300-millimeter pilot line for chip interconnects based on integrated graphene photonics.
